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Freescale Semiconductor Technical Data
MPXV5004G Rev 7, 05/2005
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXV5004G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * Temperature Compensated over 10 to 60C * Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations * Durable Thermoplastic (PPS) Package Typical Applications * * Washing Machine Water Level Ideally Suited for Microprocessor or Microcontroller-Based Systems ORDERING INFORMATION(1)
Device Type ThroughHole Surface Mount Case No. 482B 482C 482 482 482A 482A 1351 1368 1369 MPXV Series Order No. MPXV5004G7U MPXV5004GC7U MPXV5004G6U MPXV5004G6T1 MPXV5004GC6U MPXV5004GC6T1 MPXV5004DP MPXV5004GVP MPXV5004GP Packing Options Rails Rails Rails Tape & Reel Rails Tape & Reel Trays Trays Trays Device Marking MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G 1 2 3 4
MPXV5004G SERIES
INTEGRATED PRESSURE SENSOR 0 TO 3.92 kPA (0 TO 400 mm H2O) 1.0 TO 4.9 V OUTPUT
SMALL OUTLINE PACKAGES THROUGH-HOLE
J
MPXV5004G7U CASE 482B-03
MPXV5004GC7U CASE 482C-03
PIN NUMBERS(1)
N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
1. MPXV5004G series pressure sensors are available in the basic element package or with a pressure port. Two packing options are offered for the surface mount configuration.
SMALL OUTLINE PACKAGES SURFACE MOUNT
MPXV5004G6U CASE 482-01
MPXV5004GC6U CASE 482A-01
MPXV5004DP CASE 1351-01
MPXV5004GVP CASE 1368-01
MPXV5004GP CASE 1369-01
(c) Freescale Semiconductor, Inc., 2005. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Calibration Circuitry
Gain Stage #2 and Ground Reference Shift Circuitry
VOUT
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.
Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings
(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature
Symbol PMAX TSTG TA
Value 16 -30 to +100 0 to +65
Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 10 VDC, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Range Supply Voltage(1) Supply Current Span at 306 mm H2O (3 kPa) Offset(3) (4) Sensitivity Accuracy(5) 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * Offset Stability: Output deviation, after 1000 temperature cycles, *30 to 100C, and 1.5 million pressure cycles, with minimum rated pressure applied. * TcSpan: Output deviation over the temperature range of 10 to 60C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of 5C between autozero and measurement.
(2)
Symbol POP VS IS VFSS VOFF V/P --
Min 0 4.75 -- -- 0.75 -- --
Typ -- 5.0 -- 3.0 1.0 1.0 9.8 --
Max 3.92 400 5.25 10 -- 1.25 -- 1.5 2.5
Units kPa mm H2O VDC mAdc V mV V/kPa mV/mm H2O %VFSS %VFSS
MPXV5004G 2 Sensors Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV5004G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available
Fluorosilicone Gel Die Coat P1 Wire Bond Thermoplastic Case
from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MPXV5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10C to 60C using the decoupling circuit shown in Figure 3 The output will saturate outside of the specified pressure range.
Die
Stainless Steel Cap
Lead Frame
P2 Differential Sensing Element
Die Bond
Figure 2. Cross-Sectional Diagram (Not to Scale)
+5 V 5.0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] 1.5% VFSS VS = 5.0 V 0.25 Vdc TEMP = 10 to 60C
Vout Vs IPS 1.0 F 0.01 F GND
OUTPUT Output (V)
4.0
3.0 Max 2.0
Typical Min
470 pF
1.0 2 kPa 200 mm H2O 4 kPa 400 mm H2O
Figure 3. Recommended Power Supply Decoupling and Output Filtering. (For additional output filtering, please refer to Application Note AN1646.)
Figure 4. Output versus Pressure Differential (See Note 5 in Operating Characteristics)
MPXV5004G Sensors Freescale Semiconductor 3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The
Part Number MPXV5004GC6U/T1 MPXV5004G6U/T1 MPXV5004GC7U MPXV5004G7U MPXV5004GP MPXV5004DP MPXV5004GVP
Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below.
Pressure (P1) Side Identifier Side with Port Attached Stainless Steel Cap Side with Port Attached Stainless Steel Cap Side with Port Attached Side with Port Marking Stainless Steel Cap
Case Type 482A 482 482C 482B 1369 1351 1368
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.660 16.76
0.100 TYP 8X 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
MPXV5004G 4 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-A4 5
D 8 PL 0.25 (0.010)
M
TB
S
A
S
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41
S
N C H -TPIN 1 IDENTIFIER SEATING PLANE
J K M
DIM A B C D G H J K M N S
CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT
MPXV5004G Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
-A4 5
-BG
8 1
0.25 (0.010) S N
M
TB
D 8 PL S A
S
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.
DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.210 0.220 5.33 5.59 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0 15 0 15 0.405 0.415 10.29 10.54 0.540 0.560 13.72 14.22
DETAIL X
PIN 1 IDENTIFIER
C -TK M J DETAIL X
SEATING PLANE
CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE
-A4 5
N
-BG
8 1
0.25 (0.010)
M
TB
D 8 PL S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.
S DIM A B C D G J K M N S V W SEATING PLANE INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15 0 15 0 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115
DETAIL X S W
V C
PIN 1 IDENTIFIER
-TK M J DETAIL X
CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE
MPXV5004G 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.006 (0.15) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35)
D
L DETAIL G
A1
8
1
F
b 0.004 (0.1)
8X
M
CAB
B
E1
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.
GND +Vout Vs -Vout N/C N/C N/C N/C
STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.
N/C Vs GND Vout N/C N/C N/C N/C
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
DIM A A1 b D E E1 e F K L M N P T INCHES MILLIMETERS MIN MAX MIN MAX 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0 7 0 7
N
T
A
M
P
8X
0.004 (0.1)
SEATING PLANE
K
DETAIL G C
CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT
MPXV5004G Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.006 (0.15) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35)
D
L DETAIL G
A1
8
1 8X b STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.
F
0.004 (0.1)
M
CAB
B
E1
GND +Vout Vs -Vout N/C N/C N/C N/C
N/C Vs GND Vout N/C N/C N/C N/C
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
INCHES MILLIMETERS MAX MAX MIN MIN 7.62 0.300 7.11 0.280 0.25 0.05 0.002 0.010 1.07 0.96 0.038 0.042 12.32 11.81 0.465 0.485 0.690 BSC 17.52 BSC 11.81 12.32 0.485 0.465 0.100 BSC 2.54 BSC 6.10 6.60 0.260 0.240 3.43 2.92 0.135 0.115 1.52 1.02 0.040 0.060 2.41 1.90 0.055 0.035 1.39 0.095 0.89 0.075 0.28 0.011 0.23 0.009 3.30 2.79 0.110 0.130 10.54 10.28 0.405 0.415 7 0 0 7
N T K A 0.004 (0.1)
SEATING PLANE
R
P DETAIL G
8X
M
C
DIM A A1 b D E E1 e F K L M N P T R
CASE 1368-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT
MPXV5004G 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C A B A E e
5 4
GAGE PLANE
e/2 .014 (0.35)
D
L DETAIL G
A1
8
1 8X
F
b 0.004 (0.1)
M
CAB
B
E1
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
DIM A A1 b D E E1 e F K L M N P T INCHES MILLIMETERS MIN MAX MIN MAX 0.300 0.330 7.11 7.62 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.245 0.255 6.22 6.47 0.120 0.130 3.05 3.30 0.061 0.071 1.55 1.80 0.270 0.290 6.86 7.36 0.080 0.090 2.03 2.28 0.009 0.011 0.23 0.28 0.115 0.125 2.92 3.17 0 7 0 7
T
N K
A 0.004 (0.1)
SEATING PLANE
M
P
8X
DETAIL G C
CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT
MPXV5004G Sensors Freescale Semiconductor 9
NOTES
MPXV5004G 10 Sensors Freescale Semiconductor
NOTES
MPXV5004G Sensors Freescale Semiconductor 11
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MPXV5004G Rev. 7 05/2005

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